Direct Imaging System Market Size, Growth Trends & Insights Analysis Report by Type (Laser Type, UV-LED Type), by Application (IC Carrier Board, HDI Board, Flexible Board, Multilayer Board), by Region, and Competitive Landscape Forecasts, 2024-2033

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Updated on 12/25/2024

The global Direct Imaging System market is projected to exhibit substantial growth in the coming years, with a CAGR of 6.63% from 2024 to 2033, reaching a total market size of $763.52 million USD in 2024. The direct imaging system is the key equipment used in the exposure process of the PCB process, which projects the graphics directly onto the circuit board by laser or UV-LED technology.

Global Direct Imaging System Market Size and Growth Rate

The growth of the Direct Imaging System market is primarily driven by the demand from downstream markets. As the global economy develops and the population continues to grow, the increasing market demand plays an active role in the expansion of the Direct Imaging System market. Additionally, higher product quality and more affordable products will be one of the growth opportunities in this market in the future. However, the market also faces challenges such as technological risks, cost control, fierce competition, and macroeconomic fluctuations, which could potentially hinder market growth.

In 2024, the global direct imaging system market revenue by types is anticipated to demonstrate a continued growth trajectory. The laser type systems are projected to generate the highest revenue, estimated at $646.01 million USD, maintaining their dominant position in the market with an 84.61% share. This is attributed to their superior performance in high-resolution imaging and widespread adoption in advanced PCB manufacturing. On the other hand, UV-LED type systems are forecasted to contribute $117.51 million USD to the market, capturing a 15.39% share. Despite their smaller market share, UV-LED systems are recognized for their energy efficiency and longer lifespan, which are driving their adoption in certain market segments. Collectively, the total market revenue for direct imaging systems is projected to reach $763.52 million USD in 2024, reflecting a robust expansion of the industry.

Type

Market Size in 2024 (M USD)

Market Share in 2024 (%)

Laser Type

646.01

84.61%

UV-LED Type

117.51

15.39%

In 2024, the global direct imaging system market is expected to exhibit significant revenue contributions across various applications. The IC carrier board segment is projected to generate the highest revenue, estimated at $167.34 million USD, which accounts for approximately 21.92% of the total market share. Following closely, the HDI board application is anticipated to contribute $194.79 million USD, representing a 25.51% share of the market. The flexible board segment is expected to generate $146.92 million USD, capturing about 19.24% of the revenue share, while the multilayer board application is forecasted to yield $186.50 million USD, accounting for 24.43% of the market. Additionally, the “Others” category is projected to contribute $67.97 million USD, making up 8.90% of the total revenue. Overall, the total revenue for the direct imaging system market across these applications is expected to reach $763.52 million USD in 2024, highlighting the diverse demand and growth potential within the industry.

Table Global Direct Imaging System Market Size and Share by Application in 2024

Application

Market Size in 2024 (M USD)

Market Share in 2024 (%)

IC Carrier Board

167.34

21.92%

HDI Board 

194.79

25.51%

Flexible Board

146.92

19.24%

Multilayer Board

186.50

24.43%

Others

67.97

8.90%

In 2024, the global direct imaging system market exhibits a dispersed yet dynamic sales volume across various regions. Asia Pacific continues to dominate the market with an estimated sales volume of 1,014 units, maintaining an overwhelming market share of 91.35%. This significant presence can be attributed to the region’s booming electronics manufacturing industry and the high demand for advanced PCB production technologies. North America follows with a sales volume of 54 units, holding a market share of 4.86%, indicating a stable demand for direct imaging systems in the region. Europe contributes a sales volume of 35 units, capturing a 3.15% share, reflecting a consistent market presence. The “Others” category, which includes other regions not specifically mentioned, records a sales volume of 7 units, with a market share of 0.63%, showing a niche but growing interest in direct imaging systems. Collectively, these figures underscore the global reach and the varying degrees of market penetration of direct imaging systems, with a total global sales volume projected to be 1,110 units in 2024.

Global Direct Imaging System Sales Volume Market Share by Region

Orbotech was founded in 1981 and is a subsidiary of KLA. KLA develops industry-leading devices and services that foster innovation across the electronics industry.

Orbotech (KLA Corporation) offers two main products: Orbotech Corus™ and Orbotech Infinitum™. The Orbotech Corus™ 8M is a fully automated double-sided direct imaging (DI) system capable of replacing an entire DI line. It is designed for advanced high-density interconnect (HDI), including modified semi-additive processes (mSAP), and mass production of IC substrates. This integrated system enables super-fine, highly uniform lines with outstanding accuracy, creating new opportunities for manufacturers and designers. The Orbotech Corus leverages new and field-proven technologies, including Double-Sided Imaging (DSI)™, Large Scan Optics (LSO)™, and MultiWave Laser™ technologies, for exceptionally high capacity and yield with reduced total cost of ownership. As a fully integrated solution, it is compact, closed, and clean, guaranteeing cutting-edge performance and eco-friendly manufacturing.

The Orbotech Infinitum™ 10/10XT is a roll-to-roll direct imaging system designed for the mass production of flex PCBs. Driven by KLA’s Drum Direct Imaging (DDI)™ technology, the Orbotech Infinitum 10/10XT system enables optimal material handling and high-speed imaging with extremely high yield and throughput. The system leverages KLA’s field-proven Large Scan Optics (LSO)™ and MultiWave Laser™ technologies to provide superior line quality with high accuracy and uniformity for even the most delicate flex materials. As an all-in-one, compact, and closed solution, it ensures superior performance and optimal efficiency.

In 2024, Orbotech (KLA Corporation) achieved a revenue of $279.86 million USD from its Direct Imaging System market performance. This figure represents the company’s financial success in the direct imaging system sector for that year, highlighting its significant contribution to the overall revenue of KLA Corporation.

Circuit Fabology Microelectronics Equipment Co., Ltd. founded in June 2015, the company specializes in the research and development and production of direct imaging equipment and direct-write lithography equipment, which has micro-nano direct-write lithography as the core of its technology. The main products and services include PCB direct imaging equipment and automatic line system, pan-semiconductor direct writing lithography equipment and automatic line system, other laser direct imaging equipment.

CFMEE offers a leading direct imaging DI system for HDI, high-grade HDI, and SLP mass production, known as the MAS15 Series LDI. This system is designed to work with high-dose dry film for high throughput and utilizes DMD technology to ensure excellent line width consistency and edge roughness for fine lines through its high-precision data resolution capability. The MAS15 model boasts a maximum throughput of 300 sides per hour, a grid of 0.9 μm, a minimum critical dimension (CD) of 15/15 μm, a depth of focus (DOF) of ±150 μm, and a critical dimension uniformity (CDU) of ±10%. It also features a maximum exposure size of 28.5″x24.5″ and an outerlayer alignment accuracy of ±8 μm, along with a double-side alignment accuracy of 16 μm.

For the year 2024, CFMEE achieved a revenue of $97.72 million USD from its Direct Imaging System market performance. This figure reflects the company’s growth and success in the direct imaging sector, showcasing its increasing market presence and competitiveness within the industry.

ORC Manufacturing in Japan is one of the world’s leaders in manufacturing of UV Exposure, Semiconductor and LCD manufacturing equipment. In addition, ORC has been “supplying industry with light” for over a half of century as a manufacturer of specialized light sources.

ORC Manufacturing’s FDi-MP is a direct imaging system designed for high-resolution packaging PCB patterning, including FC-BGA Substrates, FC-CSP substrates, and various module substrates such as AiP. This system is capable of direct exposure of circuit patterns with a resolution of 10 µm or less and employs ORC’s unique alignment compensation technology for high-precision pattern alignment. It offers the flexibility to switch between productivity-oriented and resolution-oriented exposure modes, catering to both product development and mass production needs. The system has an expanded lineup of application-specific products based on the FDi-MP platform, with different modes featuring semiconductor laser as the light source, resolutions of 4 μm, 5 μm, and 8 μm (L/S), data resolutions of 0.1/0.25/0.5 μm, and a maximum exposure size of 515 x 515 mm, along with a total overlay accuracy of 3.5 μm.

ORC Manufacturing demonstrated a significant performance in the Direct Imaging System market, garnering a revenue of $92.44 million USD in 2024. This substantial figure underscores the company’s robust market presence and financial success within the industry. The achievement reflects ORC Manufacturing’s ability to meet the evolving demands of the market, offering advanced direct imaging solutions that cater to the PCB manufacturing sector.

Updated on 12/25/2024
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