1 Global ABF Substrate (FC-BGA) Market Outlook
The global ABF Substrate (FC-BGA) market is projected to exhibit substantial growth in the coming years, with a CAGR of 7.97% from 2024 to 2033, reaching a total market size of $7228.59 million USD in 2024. ABF Substrate (FC-BGA) refers to a high-density semiconductor packaging substrate made from Ajinomoto Build-up Film (ABF). This substrate is essential for enabling high-speed and multi-functional LSI chips, which are widely used in various applications such as CPUs, GPUs, high-end servers, ASICs for network routers/converters, MPUs for high-performance gaming machines, high-performance ASSPs, FPGAs, and ADAS in vehicle equipment. The substrate’s ability to support high-speed data transmission and complex circuitry makes it indispensable in modern electronics.
Figure Global ABF Substrate (FC-BGA) Market Size and Growth Rate (2024-2033)
2 ABF Substrate (FC-BGA) Market Growth Drivers and Constraints
The growth of the ABF Substrate (FC-BGA) market is driven by several key factors. The increasing demand for high-performance and high-computing chips is a primary driver. The development of new application fields such as cloud technology and AI has led to a surge in demand for AI chips, significantly boosting the need for ABF Substrate (FC-BGA). The construction of 5G base stations and the expansion of cloud services have also played a crucial role in driving market growth. The COVID-19 pandemic has accelerated the digital transformation, leading to rapid development in the cloud service market and increased demand for data center infrastructure.
However, the market also faces several challenges. High industry barriers and production expansion risks are significant limiting factors. The production process of ABF Substrate is complex and requires substantial investment in expensive equipment. The industry’s high capital and technical barriers make it difficult for new entrants to compete. Additionally, the market faces raw material shortages, particularly for Ajinomoto Build-up Film, which is monopolized by Ajinomoto Corporation of Japan. The company’s cautious approach to expanding production has led to supply constraints.
3 ABF Substrate (FC-BGA) Market Innovations and M&A Activities
The ABF Substrate (FC-BGA) market is characterized by continuous technological innovation and strategic corporate activities. Companies are investing heavily in R&D to improve the performance and efficiency of their substrates. For example, Unimicron Technology Corporation merged with Subtron Technology Co., Ltd. in February 2022 to enhance their combined capabilities in IC substrate and high-end PCB manufacturing. This merger aims to complement both companies’ technologies and products, integrate resources for major expansions, deploy the development of compound semiconductor substrates, and strengthen market segments in emerging fields such as electric vehicles, autonomous driving, high-frequency, high-speed applications, and the metaverse.
Another notable development is Nan Ya PCB’s acquisition of Symtek Automation Asia in November 2021. This acquisition provides Nan Ya PCB with advanced equipment and technology for printed circuit board and semiconductor processes, enhancing its production capabilities. Toppan’s acquisition of InterFlex Group in July 2021 is another example of strategic expansion, aimed at establishing a flexible packaging production network in North America and Europe.
These strategic moves reflect the industry’s focus on enhancing technological capabilities and expanding market reach. As the demand for high-performance chips continues to grow, companies are likely to continue investing in R&D and exploring strategic partnerships to stay competitive in the market.
In conclusion, the ABF Substrate (FC-BGA) market is poised for significant growth driven by the increasing demand for high-performance chips and the expansion of advanced technologies. However, the market must overcome challenges related to high industry barriers and raw material shortages. Continuous technological innovation and strategic corporate activities will play a crucial role in shaping the future of this market.
4 Global ABF Substrate (FC-BGA) Market Analysis by Type
In 2024, the global ABF Substrate (FC-BGA) market size is projected to reach USD 7,228.59 million. The market is segmented by type into 4-8 Layers ABF Substrate, 8-16 Layers ABF Substrate, and Others. Specifically, the 4-8 Layers ABF Substrate segment is expected to have a market size of USD 738.00 million, accounting for approximately 10.21% of the total market share. The 8-16 Layers ABF Substrate segment is anticipated to be the largest, with a market size of USD 5,528.92 million, representing around 76.48% of the total market share. The “Others” category, which includes substrates with more than 16 layers, is expected to have a market size of USD 961.67 million, making up about 13.31% of the total market.
Table Global ABF Substrate (FC-BGA) Market Size and Share by Type in 2024
Type | Market Size in 2024 (M USD) | Market Share in 2024 (%) |
|---|---|---|
4-8 Layers | 738.00 | 10.21% |
8-16 Layers | 5528.92 | 76.48% |
Others | 961.67 | 13.31% |
5 Global ABF Substrate (FC-BGA) Market Analysis by Application
In 2024, the global ABF Substrate (FC-BGA) market size by application is projected as follows:
PCs: The market size is expected to be around USD 3,336.01 million, with a market share of approximately 46.15%.
Server & Switch: The market size is anticipated to be USD 1,774.35 million, accounting for about 24.55% of the total market share.
Game Consoles: With a market size of USD 419.58 million, it is expected to hold a market share of around 5.81%.
AI Chip: The market size is projected to be USD 757.45 million, making up approximately 10.48% of the total market share.
Communication Base Station: The market size is expected to be USD 621.35 million, with a market share of about 8.60%.
Others: The market size is estimated to be USD 319.85 million, representing around 4.42% of the total market share.
These figures indicate that PCs continue to dominate the application segment, followed by Server & Switch and AI Chip applications. The market is driven by the increasing demand for high-performance computing and advanced semiconductor packaging solutions across various industries.
Table Global ABF Substrate (FC-BGA) Market Size and Share by Application in 2024
Application | Market Size in 2024 (M USD) | Market Share in 2024 (%) |
|---|---|---|
PCs | 3336.01 | 46.15% |
Server & Switch | 1774.35 | 24.55% |
Game Consoles | 419.58 | 5.81% |
AI Chip | 757.45 | 10.48% |
Communication Base Station | 621.35 | 8.60% |
Others | 319.85 | 4.42% |
6 Global ABF Substrate (FC-BGA) Market Analysis by Region
In 2024, the global ABF Substrate (FC-BGA) market size is projected to be USD 7228.59 million. The market is segmented by region as follows:
North America: The market size is expected to be USD 1,164.23 million, accounting for approximately 16.11% of the global market share.
Europe: The market size is projected to be USD 442.85 million, representing about 6.13% of the global market share.
Asia-Pacific: This region is anticipated to have the largest market size at USD 5,357.53 million, making up around 74.12% of the global market share.
South America: The market size is expected to be USD 137.95 million, with a market share of approximately 1.91%.
Middle East & Africa: The market size is projected to be USD 126.02 million, accounting for about 1.74% of the global market share.
These figures highlight the significant dominance of the Asia-Pacific region in the global ABF Substrate (FC-BGA) market, driven by the high demand for semiconductor devices in countries like China, Japan, and South Korea.
Figure Global ABF Substrate (FC-BGA) Market Share by Region in 2024
7 Top 3 Companies of Global ABF Substrate (FC-BGA) Market
7.1 Unimicron
Company Introduction and Business Overview:
Unimicron is a leading manufacturer of advanced semiconductor packaging materials, with a strong focus on ABF Substrate (FC-BGA) solutions. Established in 1990, the company is headquartered in Taiwan and has a significant presence in both Taiwan and China. Unimicron specializes in the development, manufacture, and sale of high-density interconnect printed circuit boards (HDI PCBs), flexible printed circuits (FPCs), and integrated circuit (IC) testing system products. The company’s products are widely used in computers, communication devices, and consumer electronics, making it a crucial player in the global electronics supply chain.
Products Offered:
Unimicron offers a comprehensive range of ABF Substrate (FC-BGA) products, designed to meet the high-performance demands of modern semiconductor applications. Their substrates are used in various applications, including CPUs, GPUs, high-performance computing (HPC), AI chips, and 5G networking infrastructure. The company is known for its advanced manufacturing capabilities and ability to deliver high-quality, reliable products.
Sales Revenue in the Latest Year:
Unimicron’s ABF Substrate (FC-BGA) business achieved significant revenue growth. The company’s total revenue from this segment was approximately USD 1,375.74 million. This growth is attributed to the increasing demand for high-performance chips and the company’s strategic focus on expanding its production capacity to meet market needs.
7.2 Ibiden
Company Introduction and Business Overview:
Ibiden is a Japanese multinational company with a long history dating back to 1912. The company is renowned for its expertise in plastic packaging, printed circuit boards, and related products. Ibiden’s electronics business focuses on providing high-quality and reliable IC packaging solutions, leveraging advanced technologies and innovative manufacturing processes. The company’s global presence and commitment to technological innovation have solidified its position as a key player in the ABF Substrate (FC-BGA) market.
Products Offered:
Ibiden offers a wide range of products, including flip-chip packaging substrates and build-up substrates. These products are designed to support high-speed and high-density semiconductor applications, making them ideal for use in PCs, servers, and data centers. The company’s substrates are known for their fine line patterning, multilayer structure, and excellent electrical characteristics, which contribute to their high performance and reliability.
Sales Revenue in the Latest Year:
Ibiden’s ABF Substrate (FC-BGA) business recorded a revenue of approximately USD 1,061.38 million. This revenue growth reflects the company’s ability to meet the increasing market demand for advanced semiconductor packaging solutions and its ongoing efforts to enhance its product offerings.
7.3 Nan Ya PCB
Company Introduction and Business Overview:
Nan Ya PCB Corporation is a prominent manufacturer of printed circuit boards (PCBs) and IC substrates, with its roots dating back to 1997. The company is part of the Formosa Plastics Group and has established a strong reputation for its high-quality products and advanced manufacturing capabilities. Nan Ya PCB operates manufacturing facilities in both Taiwan and China, enabling it to serve a global customer base effectively.
Products Offered:
Nan Ya PCB offers a diverse range of products, including ABF Substrate (FC-BGA) solutions. The company’s substrates are designed to support various applications, such as CPUs, GPUs, and high-performance computing devices. Nan Ya PCB’s products are known for their reliability, high performance, and ability to meet the stringent requirements of modern semiconductor applications.
Sales Revenue in the Latest Year:
Nan Ya PCB’s ABF Substrate (FC-BGA) business achieved a revenue of approximately USD 790.47 million. This revenue growth highlights the company’s strong market position and its ability to capitalize on the increasing demand for advanced semiconductor packaging solutions.